Substrates · Kaspix

Kaspix · Substrates

Restricted access · Kaspix

Kaspix · Substrates

Comparing ceramic materials for RF modules. Every number carries its source.

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The brief

move a control and everything recalculates

Dissipated power 10 W

Die side 3.0 mm

Thickness 0.635 mm

Thermal budget 40 °C

Frequency 28 GHz

Trace length 10 mm

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within the thermal budget

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suspect data — verify the source

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with unpublished properties

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materials in the library

Ranked by temperature rise. Click any row to see where each number came from.

#	Material	k W/m·K	R_th °C/W	ΔT °C	Δα vs die ppm/°C	W 50Ω µm	Loss dB	Thermal	Data
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